Eliminating Chipout in Laminated Particleboard

In the late 2000s, a major Australian particleboard manufacturing facility faced significant challenges with chipout during high-speed CNC machining of laminated board, rendering the product commercially unsaleable and jeopardizing the site's future. This chipout issue was initially linked to flake geometry and the aging production equipment. However, a thorough analysis utilizing light and electron microscopy revealed that the true cause was poor resin distribution in the particleboard blending process, even within newer-generation blender systems. Implementing Rezex SS20 technology could provide a solution for chipout elimination and enhance overall product quality.

To address the challenges in particleboard manufacturing, we developed Rezex SS20 technology, a patented multi-phase wetting solution that significantly enhances the spreading and penetration of water-based fluids on difficult-to-wet surfaces like particleboard flake. 

When incorporated into amino MUF resins at very low concentrations, Rezex SS20 technology effectively achieved chipout elimination, eliminating the need for major capital investment. 

This innovative technology was later applied to tackle similar manufacturing issues at another Australian wood panel facility. 

The results demonstrated that improved resin wetting and distribution can greatly enhance board machinability, product quality, and manufacturing efficiency, all while reducing the reliance on costly plant modifications.